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ASPLOS PLDI CGO EuroSys MICRO HPCA PPoPP SIGMETRICS
Distinguished Artifact Evaluator Award, ACM EuroSys 2026 (announcement)

Artifact Evaluation Committee

  • ASPLOS 2026, 2027 - ACM International Conference on Architectural Support for Programming Languages and Operating Systems
  • PLDI 2025 - ACM SIGPLAN Conference on Programming Language Design and Implementation
  • CGO 2025, 2026, 2027 - IEEE/ACM International Symposium on Code Generation and Optimization
  • EuroSys 2026 - ACM European Conference on Computer Systems
  • MICRO 2023, 2024, 2025 - IEEE/ACM International Symposium on Microarchitecture
  • HPCA 2025, 2026 - IEEE International Symposium on High-Performance Computer Architecture
  • PPoPP 2025, 2026 - ACM SIGPLAN Symposium on Principles and Practice of Parallel Programming
  • FCCM 2024 - IEEE International Symposium on Field-Programmable Custom Computing Machines
  • IPDPS - RAW 2023, 2024 - Reconfigurable Architectures Workshop at the IEEE International Parallel and Distributed Processing Symposium

Program Committees

  • SIGMETRICS 2027 (TPC), 2026 (Shadow PC) - ACM SIGMETRICS International Conference on Measurement and Modeling of Computer Systems (2027 committee)
  • HiPC 2026 (Hardware Technology track) - 33rd IEEE International Conference on High Performance Computing (committee)
  • ISVLSI 2025 - IEEE Computer Society Annual Symposium on VLSI
  • HSTIEC 2025, 2026 - Hardware, Software, and Tools for the IoT-to-Edge-to-Cloud Continuum, Special Session at the Euromicro Conference on Digital System Design (DSD)

Organizing Committee

  • CloudNet 2026 - Workshop Co-Chair, Special Session “An AI-Orchestrated Architecture: Data Plane, Digital Twin, and Smart Marketplace for 6G Networks of Networks”, 14th IEEE International Conference on Cloud Networking, Athens (call for papers)
  • NFV-SDN 2025 - Special Session “An AI-Orchestrated Architecture: Data Plane, Digital Twin, and Smart Marketplace for 6G Networks of Networks”, IEEE Conference on Network Function Virtualization and Software Defined Networks

Session Chair

  • DAC 2024 - Session “Memory is the scribe of the soul, be it volatile or not”, 61st ACM/IEEE Design Automation Conference
  • RTSI 2022 - Special Session “Sensors for a smarter world”, IEEE 7th International Forum on Research and Technologies for Society and Industry

Journal Reviewer

61 verified reviews on Web of Science:

  • IEEE TCAD - Transactions on Computer-Aided Design of Integrated Circuits and Systems (23 reviews)
  • IEEE TVLSI - Transactions on Very Large Scale Integration Systems (20 reviews)
  • JPDC - Journal of Parallel and Distributed Computing (9 reviews)
  • ACM TRETS - Transactions on Reconfigurable Technology and Systems (8 reviews)
  • IEEE IT Professional (1 review)

Conference Reviewer

  • FPL 2025 - IEEE International Conference on Field-Programmable Logic and Applications
  • FCCM 2024 - IEEE International Symposium on Field-Programmable Custom Computing Machines
  • ISCAS 2024, 2025, 2026 - IEEE International Symposium on Circuits and Systems
  • ICCAD 2023 - IEEE/ACM International Conference on Computer-Aided Design
  • EUROCON 2023 - IEEE International Conference on Smart Technologies
  • CODES+ISSS - ACM/IEEE International Conference on Hardware/Software Codesign and System Synthesis (Embedded Systems Week)